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Description: IC SOC CORTEX-A53 784FCBGA
Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
| Category: | Integrated Circuits (ICs)
Embedded
System On Chip (SoC) | Base Product Number: | XCZU3 | Product Status: | Active | Peripherals: | DMA, WDT | Primary Attributes: | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | Series: | Zynq® UltraScale+™ MPSoC EG | Package: | Tray | Mfr: | AMD | Supplier Device Package: | 784-FCBGA (23x23) | Connectivity: | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Operating Temperature: | 0°C ~ 100°C (TJ) | Architecture: | MCU, FPGA | Package / Case: | 784-BFBGA, FCBGA | Number Of I/O: | 252 | RAM Size: | 256KB | Speed: | 500MHz, 600MHz, 1.2GHz | Core Processor: | Quad ARM® Cortex®-A53 MPCore™ With CoreSight™, Dual ARM®Cortex™-R5 With CoreSight™, ARM Mali™-400 MP2 | Flash Size: | - | 
| Category: | Integrated Circuits (ICs)
Embedded
System On Chip (SoC) | 
| Base Product Number: | XCZU3 | 
| Product Status: | Active | 
| Peripherals: | DMA, WDT | 
| Primary Attributes: | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 
| Series: | Zynq® UltraScale+™ MPSoC EG | 
| Package: | Tray | 
| Mfr: | AMD | 
| Supplier Device Package: | 784-FCBGA (23x23) | 
| Connectivity: | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 
| Operating Temperature: | 0°C ~ 100°C (TJ) | 
| Architecture: | MCU, FPGA | 
| Package / Case: | 784-BFBGA, FCBGA | 
| Number Of I/O: | 252 | 
| RAM Size: | 256KB | 
| Speed: | 500MHz, 600MHz, 1.2GHz | 
| Core Processor: | Quad ARM® Cortex®-A53 MPCore™ With CoreSight™, Dual ARM®Cortex™-R5 With CoreSight™, ARM Mali™-400 MP2 | 
| Flash Size: | - | 
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